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Šī tīmekļa lapa darbībai ir vajadzīgs JavaScript atbalsts. Lūdzu, ieslēdziet JavaScript savā pārlūkprogrammas iestatījumos.

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Deze webpagina vereist JavaScript om correct te functioneren. Schakel JavaScript in uw browserinstellingen in.

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เว็บไซต์นี้ต้องการ JavaScript เพื่อทำงานอย่างถูกต้อง โปรดเปิด JavaScript ในการตั้งค่าบราวเซอร์ของคุณ

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Эн вэб хуудас нь зөв ажиллахын тулд JavaScript дэмжлэг авах шаардлагатай. Таны броузерын тохиргоонд JavaScript-ийг идэвхжүүлнэ үү.

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ບໍ່ສາມາດເຮັດວຽກເວັບໄຊນີ້ໄດ້ຖ້າບໍ່ມີການສະຫລັບ JavaScript. ກະລຸນາໃຊ້ການຕັ້ງຄ່າຂອງເວັບໄຊໃຫ້ເປີດ JavaScript ກ່ອນ.

ទំព័រវេបសាយនេះត្រូវការ JavaScript ដើម្បីដំណើរការប្រើប្រាស់បានល្អ។ សូមបើក JavaScript នៅក្នុងការកំណត់របស់អ្នកក្នុងក

  I See Taiwan, IC Grand Challenge begins now - The Commercial Office of Taipei, Dubai, U.A.E. 駐杜拜臺北商務辦事處
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I See Taiwan, IC Grand Challenge begins now

What is it all about?
The Taiwan Chip-based Industrial Innovation Program (Taiwan CbI) is a collaborative effort by various Taiwanese government ministries. It aims to make the most of Taiwan's expertise in semiconductor technology by combining chips with important innovations like generative AI.
To boost Taiwan's position as a leading IC startup cluster, the National Science and Technology Council (NSTC) organizes the IC Taiwan Grand Challenge. It offers local incentives such as chip tape-out, masks, and IP services, collaborates with leading semiconductor companies for investment, and establishes public-private venture capital funds.
In 2024, the IC Taiwan Grand Challenge debuted, aiming to discover promising teams early and connect them with Taiwan. It will spotlight global startups and academic groups focusing on IC design innovations and Chip-based innovative applications. Top selections will be invited to establish bases in Taiwan, linking them with funding to advance chip innovations, leveraging the world's most comprehensive semiconductor industry ecosystem to support creative endeavors.
The first round of online application ends on June 30, 2024, whereas the second round of online application will end on Jan 31, 2025.