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เว็บไซต์นี้ต้องการ JavaScript เพื่อทำงานอย่างถูกต้อง โปรดเปิด JavaScript ในการตั้งค่าบราวเซอร์ของคุณ

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ບໍ່ສາມາດເຮັດວຽກເວັບໄຊນີ້ໄດ້ຖ້າບໍ່ມີການສະຫລັບ JavaScript. ກະລຸນາໃຊ້ການຕັ້ງຄ່າຂອງເວັບໄຊໃຫ້ເປີດ JavaScript ກ່ອນ.

ទំព័រវេបសាយនេះត្រូវការ JavaScript ដើម្បីដំណើរការប្រើប្រាស់បានល្អ។ សូមបើក JavaScript នៅក្នុងការកំណត់របស់អ្នកក្នុងក

  2023 Taiwan Semiconductor Summer Programs open... - Taipei Representative Office, Bratislava 駐斯洛伐克台北代表處
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2023 Taiwan Semiconductor Summer Programs open for application

2023 Taiwan semiconductor Summer Programs

I. IC Design + Semiconductor Forum (in principle 6 candidates)

  1. Time: Aug. 6 ~ Aug. 19 + Aug. 20~Aug 26, 2023
  2. Venue: National Taiwan University in Taipei (IC Design) and National Semiconductor Research Institute (Semiconductor Forum)
  3. Deadline of application: May 15, 2023
  4. Eligibility: 1) Slovak students, who have completed at least 2 years from semiconductor related faculties of universities, or 2) Slovak teachers or researchers from semiconductor related faculties of universities, or 3) Slovak talents who are working in semiconductor related industries.
  5. Required Documents: 1) Application form, 2) a copy of Slovak passport, 3) 3 photos (3.5*4.5 cm), 4) a copy of highest-degree diploma, 5) transcripts of record or an employment certificate
  6. Allowance: 1,000 TWD daily (= 29EUR)
  7. Training fee, flight tickets and accommodation: covered by Taiwanese side

II. Materials program + Semiconductor Forum (in principle 6 candidates)

  1. Time: Aug. 6 ~ Aug. 19 + Aug. 20~Aug 26, 2023
  2. Deadline of application: May 15, 2023
  3. Eligibility: 1) Slovak students, who have completed at least 2 years from semiconductor-related faculties of universities, or 2) Slovak teachers or researchers from semiconductor related faculties of universities, or 3) Slovak talents who are working in semiconductor related industries
  4. Required Documents: 1) Application form, 2) a copy of Slovak passport, 3) 3 photos (3.5*4.5 cm), 4) a copy of highest-degree diploma, 5) transcripts of record or an employment certificate
  5. Allowance: 1,000 TWD daily (= 29EUR)
  6. Training fee, flight tickets and accommodation: covered by Taiwanese side

The application period starts from now until May 15, 2023. Please mail the documents by post to the following:

Zoya WANG at Taipei Representative Office, Bratislava (TROB)

Add: Mostova 2, 811 02 Bratislava, Slovak Republic.

Information and schedule of summer programs

summer programs_application form